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Riveted Bent Section OD4.5*ID4.2*42mm Bidirectional

Riveted Bent Section OD4.5*ID4.2*42mm Bidirectional
Riveted Bent Section OD4.5*ID4.2*42mm Bidirectional

Riveted Bent Section OD4.5*ID4.2*42mm Bidirectional

Precision metal component made to your drawings for endoscopy and interventional devices. Contact us for material, tolerance and OEM requirements.

  • ISO 13485
  • Low MOQ
  • Quick Respond
  • Samples in 7–15 Days

Riveted Bending Section|Product Overview

This product is an articulated bidirectional bending core steering component for endoscopes, used for distal-end bending and steering assembly in medical and industrial endoscopes.

Core Parameters

Outer diameter (OD): 4.5mm, slim outer diameter, excellent passability through narrow cavities

Inner diameter (ID): 4.2mm, large central through-hole, can accommodate camera modules, light guides, water/air channels, and micro surgical instruments

Effective bending length: 42mm

Structure: riveted joint structure

Steering mode: bidirectional bending

Application: medical flexible endoscopes, flexible industrial inspection endoscopes

Product Features

  1. Ultra-thin-wall, large through-cavity design with high internal space utilization

  2. Riveted joints rotate smoothly without jamming, with stable and reliable bending angles

  3. High overall machining accuracy and excellent coaxiality; no wobble during steering and stable imaging

  4. Smooth, low-friction outer wall for smooth insertion; resistant to body fluids and media corrosion

  5. End-to-end positioning structure; simple traction wire threading and outer sheath covering; suitable for large-scale mass-production assembly

Core Advantages

Ultra-fine outer diameter for easy bending|Large through-cavity for multi-functional routing|Durable and stable riveted structure|Simple bidirectional control|Convenient assembly and mass production

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Start Your Medical Precision Metal Machining Project

An ISO13485-certified company with a class-10,000 cleanroom, offering one-stop laser machining for endoscope bending sections, hypotubes and semiconductor precision components — from design optimization to volume delivery.

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