
Single-use bending section OD3.9*ID3.5*L50, bidirectional
Single-use bending section OD3.9*ID3.5*L50, bidirectional
Precision metal component made to your drawings for endoscopy and interventional devices. Contact us for material, tolerance and OEM requirements.
- ISO 13485
- Low MOQ
- Quick Respond
- Samples in 7–15 Days
Product Description
Product Basic Parameters
Outer Diameter OD: 39 mm
Inner Diameter ID: 35 mm
Wall Thickness: 2 mm
Bending Method: Bidirectional bending (up/down articulation)
Product Attribute: Single-use endoscope bending-section articulation skeleton
Manufacturing Process: Precision riveted multi-segment ring structure
Product Features
Ultra-large lumen, ID35 large inner bore, can integrate multiple instrument channels, large-diameter optical paths, water/air channels, and wiring harnesses, suitable for passage of large-sized surgical instruments.
Balanced bidirectional articulation, stable up/down bending angles, uniform control damping, smooth bending without jamming, high consistency in wire tension transmission.
Single-use dedicated structure, meets clean requirements for single-use endoscope assembly, no repeated disinfection required, avoids cross-infection, optimizes overall device cost.
Rounded edges on segment rings, smooth outer surface, low insertion resistance, reduces risk of scratching the lumen; uniform pitch, natural transition of bending deformation.
Large-diameter high-strength riveted structure, multiple segment rings riveted into shape, strong radial deformation resistance, not prone to segment misalignment or loosening under large-size working conditions.
Modular design, can be assembled with traction lugs and traction wire components; supports customization of effective bending length and maximum articulation angle.
Application Scenarios
Large-diameter single-use flexible endoscopes, special minimally invasive interventional instruments, bending sections of industrial large-cavity inspection endoscopes
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An ISO13485-certified company with a class-10,000 cleanroom, offering one-stop laser machining for endoscope bending sections, hypotubes and semiconductor precision components — from design optimization to volume delivery.