Product Overview

This gold-plated precision beryllium copper terminal is manufactured using chemical etching integrated one-piece forming. The substrate uses a high-elasticity beryllium copper alloy with a gold-plated surface, integrating multi-channel conductive terminals and a flexible structure. It is a core signal conduction component in precision optoelectronics, sensing, and micro modules. The structure has a compact layout and uses PI insulating film for zoned isolation, enabling independent transmission of multiple signals. It combines elastic contact, low impedance, fatigue resistance, and other characteristics.

Product Features

✅ Beryllium copper substrate, excellent elasticity ✅ Gold-plated surface, stable conductivity ✅ Integrated precision etching forming ✅ Positioning hole design, suitable for automated assembly ✅ Integrated structure, saves space

Material and Surface Treatment

Substrate: Beryllium copper

Surface treatment: Selective gold plating / full gold plating (gold plating thickness can be adjusted as needed)

Application Scenarios

Camera modules, optical sensors, miniature inspection probes, medical precision sensing components, precision connectors, miniature optoelectronic modules, and instrumentation signal acquisition terminals.